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After securing sufficient yield and cost-effectiveness, Samsung Electronics decided to launch the next generation 2nm GAA process node. |
Samsung Electronics has reportedly delayed the mass production of its next-generation 2nm GAA (Gate-All-Around) process node, prioritizing yield stability and customer trust over being first to market.
According to industry sources, the initial launch of Samsung’s 2nm node—originally expected in late 2024—has been pushed back to 2026, signaling a strategic departure from the aggressive rollout timelines set by key competitor TSMC, which has already commenced early 2nm production.
Yield, Not Speed
Samsung’s decision centers around its current 2nm GAA yield rate, which is said to be in the mid-40% range, well below the industry’s commercial viability threshold of around 70%. While Samsung has made recent improvements, analysts suggest that reaching production-level yields this year will be difficult.
The company is therefore opting to refine quality and yield through repeated process tuning, rather than pursuing premature mass production. This approach aims to ensure long-term competitiveness by building customer confidence through stable, high-performance nodes.
Focusing on One Node, Delaying Another
Amid earlier reports that Samsung was developing multiple advanced process variants—including 1.4nm technology—the company is now said to be consolidating efforts around 2nm GAA, pausing its 1.4nm development roadmap in the process.
Samsung’s Pyeongtaek facility has reportedly completed the base design infrastructure for the 2nm node, but has yet to secure any major high-volume customer orders.
Risk and Reward
By delaying its 2nm rollout, Samsung may be forced to offer discounted wafer prices to stay competitive with TSMC, which could dominate early market share. However, Samsung appears confident that 2nm chip demand will remain strong for at least four years, allowing time to recapture market trust in the mobile, server, and high-performance computing (HPC) sectors.
A Samsung spokesperson emphasized that the company is now prioritizing thermal control and chip stability in the 2nm GAA node as part of its plan to become a serious contender by 2026.
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